The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Feb. 16, 2016
Filed:
Mar. 14, 2013
Applicant:
Henkel Ip & Holding Gmbh, Duesseldorf, DE;
Inventor:
Jie Bai, Aliso Viejo, CA (US);
Assignee:
Henkel IP & Holding GmbH, Duesseldorf, DE;
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 23/29 (2006.01); C08G 59/42 (2006.01); C08L 63/00 (2006.01); H01L 23/00 (2006.01);
U.S. Cl.
CPC ...
H01L 23/293 (2013.01); C08G 59/42 (2013.01); C08L 63/00 (2013.01); H01L 23/562 (2013.01); H01L 2924/0002 (2013.01);
Abstract
Thermosetting resin compositions useful for liquid compression molding encapsulation of a silicon wafer are provided. The so-encapsulated silicon wafers offer improved resistance to warpage, compared to unencapsulated wafers or wafers encapsulated with known encapsulation materials.