The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Feb. 23, 2021
Filed:
May. 17, 2018
Applicant:
Henkel Ip & Holding Gmbh, Duesseldorf, DE;
Assignee:
HENKEL IP & HOLDING GMBH, Duesseldorf, DE;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
C08L 63/00 (2006.01); C08G 59/18 (2006.01); H01L 23/29 (2006.01); C08G 59/32 (2006.01); C08G 59/50 (2006.01); C08G 59/68 (2006.01); C08J 5/18 (2006.01); C08K 5/13 (2006.01); C08K 5/3415 (2006.01); C08L 83/12 (2006.01); H01L 21/56 (2006.01);
U.S. Cl.
CPC ...
C08L 63/00 (2013.01); C08G 59/18 (2013.01); C08G 59/3281 (2013.01); C08G 59/5073 (2013.01); C08G 59/686 (2013.01); C08J 5/18 (2013.01); C08K 5/13 (2013.01); C08K 5/3415 (2013.01); C08L 83/12 (2013.01); H01L 23/293 (2013.01); C08G 2650/56 (2013.01); C08J 2363/00 (2013.01); C08J 2371/00 (2013.01); C08J 2479/08 (2013.01); C08L 2203/16 (2013.01); H01L 21/563 (2013.01);
Abstract
Provided herein are mixed resin systems and the use thereof for wafer-level underfill (WAUF) for three-dimensional TSV packages. In one aspect, there are provided compositions comprising (1) an epoxy resin, (2) a maleimide, nadimide or itaconamide, (3) a toughening agent and (4) a filler. In certain aspects, the invention relates to underfill films prepared from invention compositions. In certain aspects, the invention relates to articles comprising the underfill films described herein.