The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Sep. 16, 2014
Filed:
Nov. 19, 2012
Applicant:
Henkel Corporation, Rocky Hill, CT (US);
Inventors:
Assignee:
Henkel IP Holding GmbH, Duesseldorf, DE;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
C08L 63/00 (2006.01); C08L 63/02 (2006.01); C08L 63/06 (2006.01); B32B 27/38 (2006.01); C09J 163/00 (2006.01); C09J 163/02 (2006.01); C09J 163/06 (2006.01); C09J 133/04 (2006.01); C08L 33/02 (2006.01); C08L 33/06 (2006.01);
U.S. Cl.
CPC ...
C09J 163/00 (2013.01); C08L 33/02 (2013.01); C08L 63/00 (2013.01); C08L 33/068 (2013.01); C09J 133/04 (2013.01);
Abstract
Novel adhesive compositions that can be used in the die attach process. The adhesives include a curable resin component, a curing agent, and a block copolymer additive. The block copolymer additive has a glass transition temperature of at least about 40° C. The block copolymer additive improves the affinity of the adhesive composition to a hydrophilic substrate, such as a silicon wafer, during the die pickup process. Also disclosed is an assembly which includes a hydrophilic substrate and a layer of adhesive and methods of producing the assembly.