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For the Inventor, By the Inventor

San Diego, CA, United States of America

Puwei Liu

This inventor holds 22 USPTO granted patents and 9 published patent applications and 5 EPO patents, primarily in Adhesive Compositions. Top assignees: Henkel Corporation, Henkel IP Holding Gmbh, Henkel Ag & Company, Kgaa. Active years: 2004-2021.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Puwei Liu. Retrieved from https://idiyas.com/inventor/puwei-liu

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

Calculating rank
USPTO Granted Patents = 22 

% Patents Active = 45.5

 

Average Co-Inventor Count = 2.5

ph-index = 10

Forward Citations = 382(Granted Patents)


Location History:

  • San Diego, CA (US) (2004 - 2014)
  • San Marcos, CA (US) (2009 - 2017)
  • Glastonbury, CT (US) (2019 - 2021)

Company Filing History:

goldMedal16 out of 1,087 
 
Henkel Corporation
 patents
silverMedal5 out of 396 
 
Henkel IP Holding Gmbh
 patents
bronzeMedal1 out of 4,550 
 
Henkel Ag & Company, Kgaa
 patents
4. 1 out of 18 
 
Henkel Ireland Limited
 patents
5. 1 out of 834,708 
Other
 patents
where one patent can have more than one assignee

Years Active: 2004-2021

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Areas of Expertise:
Transparent Adhesive
Solder Pastes
Die Attach
Thermosetting Resins
Conductive Ink
Polymer Coated Powders
Curing Agents
Low Shrinkage
22 patents (USPTO):Explore Patents
1. 11174419 - Light stable transparent adhesive compositions and methods for use thereof (2021-11-16),
2. 10189121 - Organic acid-or latent organic acid-functionalized polymer-coated metal powders for solder pastes (2019-01-29),
3. 9682447 - Organic acid- or latent organic acid-functionalized polymer-coated metal powders for solder pastes (2017-06-20),
4. 9427829 - Di- or poly-functional electron deficient olefins coated metal powders for solder paste (2016-08-30),
5. 8835574 - Adhesive compositions for use in die attach applications (2014-09-16),
6. 8698320 - Curable resin compositions useful as underfill sealants for use with low-k dielectric-containing semiconductor devices (2014-04-15),
7. 8486498 - Thermally decomposable polymer coated metal powders (2013-07-16),
8. 8338536 - Adhesive compositions for use in die attach applications (2012-12-25),
9. 8278396 - Curing agents for epoxy resins (2012-10-02),
10. 7973158 - Method of preparing benzoxazines (2011-07-05),
11. 7851254 - B-stageable die attach adhesives (2010-12-14),
12. 7550825 - Interlayer dielectric and pre-applied die attach adhesive materials (2009-06-23),
13. 7517925 - Benzoxazines, thermosetting resins comprised thereof, and methods for use thereof (2009-04-14),
14. 7312534 - Interlayer dielectric and pre-applied die attach adhesive materials (2007-12-25),
15. 7199249 - Free radically polymerizable coupling agents (2007-04-03),

Title: Puwei Liu: Pioneering Inventor from San Diego

Introduction: Puwei Liu is a distinguished inventor based in San Diego, CA, known for his groundbreaking contributions to various technological fields.

Latest Patents: Puwei Liu holds several patents in the areas of biotechnology, renewable energy, and artificial intelligence, showcasing his versatility and innovative spirit.

Career Highlights: With over two decades of experience in research and development, Puwei Liu has worked with leading tech companies and research institutions, consistently pushing the boundaries of innovation.

Collaborations: Throughout his career, Puwei Liu has collaborated with top scientists, engineers, and experts in multidisciplinary projects, fostering a culture of creativity and excellence.

Conclusion: Puwei Liu's passion for innovation and his dedication to creating solutions for complex challenges make him a true trailblazer in the world of technology.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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