The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jun. 23, 2009
Filed:
Jun. 05, 2007
Benedicto Delos Santos, San Diego, CA (US);
James T. Huneke, San Diego, CA (US);
Puwei Liu, San Marcos, CA (US);
Kang Yang, San Diego, CA (US);
Qing Ji, El Monte, CA (US);
Benedicto delos Santos, San Diego, CA (US);
James T. Huneke, San Diego, CA (US);
Puwei Liu, San Marcos, CA (US);
Kang Yang, San Diego, CA (US);
Qing Ji, El Monte, CA (US);
Henkel Corporation, Rocky Hill, CT (US);
Abstract
The present invention relates to interlayer dielectric materials and pre-applied die attach adhesives, more specifically pre-applied die attach adhesives (such as wafer and other substrate-applied die attach adhesives), methods of applying the interlayer dielectric materials onto substrates to prepare low K dielectric semiconductor chips, methods of applying the pre-applied die attach adhesives onto wafer and other substrate surfaces, and assemblies prepared therewith for connecting microelectronic circuitry.