Qing Ji

Title: Innovations by Qing Ji: A Pioneer in Semiconductor Packaging

Introduction

Qing Ji is an accomplished inventor based in El Monte, California, known for her significant contributions to the field of semiconductor packaging. With a total of 4 patents to her name, she has developed innovative methods that enhance the efficiency and reliability of semiconductor devices.

Latest Patents

One of her latest patents is titled "Method of fabricating a semiconductor package using a fluxing underfill composition applied to solder balls in a dip process." This invention focuses on a novel approach to fabricating semiconductor packages, utilizing a fluxing underfill composition that is applied to solder contact points through a dip process. Another notable patent is for "Low exothermic thermosetting resin compositions useful as underfill sealants and having reworkability." This invention addresses the need for thermosetting resin compositions that are effective for mounting semiconductor devices onto circuit boards, ensuring reworkability and stability under various conditions.

Career Highlights

Qing Ji is currently employed at Henkel Corporation, where she continues to push the boundaries of innovation in semiconductor technology. Her work has been instrumental in developing materials that not only improve the performance of semiconductor packages but also simplify the manufacturing process.

Collaborations

Throughout her career, Qing Ji has collaborated with talented individuals such as Benedicto Delos Santos and James T Huneke. These partnerships have fostered a creative environment that encourages the exchange of ideas and the development of groundbreaking technologies.

Conclusion

Qing Ji's contributions to semiconductor packaging exemplify the spirit of innovation and dedication to advancing technology. Her patents reflect a commitment to improving the efficiency and reliability of semiconductor devices, making her a notable figure in the field.