Henkel Corporation

Qing Ji

Puwei Liu

Kang Yang

James T Huneke

Benedicto Delos Santos

Chew Beng Chan

Hwang Kyu Yun

Weitong Shi

Geraldine Kelly

Renzhe Zhao

Mark Currie

Neil Poole

The present invention relates to a method of fabricating a semiconductor package or circuit assembly using an fluxing underfill composition applied to solder contact points in a dip process.

Method of fabricating a semiconductor package using a fluxing underfill composition applied to solder balls in a dip process

This invention relates to the thermosetting resin compositions useful for mounting onto a circuit board semiconductor devices, such as chip size or chip scale packages ('CSPs'), ball grid arrays ('BGAs'), land grid arrays (&#x201c;LGAs&#x201d;) and the like, each of which having a semiconductor chip, such as large scale integration (&#x201c;LSI&#x201d;), on a carrier substrate. Similarly, the compositions are useful for mounting onto circuit board semiconductor chips themselves. Reaction products of the compositions of this invention are controllably reworkable when subjected to appropriate conditions. And significantly, unlike many commercial rapid curing underfill sealants (&#x201c;snap cure underfills&#x201d;), the inventive compositions possess an exotherm under 300 J/g or demonstrate package stability at 55&#xb0; C. for 7 days, and therefore do not require special packaging to be transported by air courier, or special approval from international transportation authorities, such as the U.S. Department of Transportation, to permit such air transport. The inventive compositions possess an exotherm under 300 J/g and/or demonstrate package stability at 55&#xb0; C. for 7 days and therefore do not require special packaging to be transported by air courier, or special approval from international transportation authorities, such as the U.S. Department of Transportation, to permit such air transport.

Low exothermic thermosetting resin compositions useful as underfill sealants and having reworkability

The present invention relates to interlayer dielectric materials and pre-applied die attach adhesives, more specifically pre-applied die attach adhesives (such as wafer and other substrate-applied die attach adhesives), methods of applying the interlayer dielectric materials onto substrates to prepare low K dielectric semiconductor chips, methods of applying the pre-applied die attach adhesives onto wafer and other substrate surfaces, and assemblies prepared therewith for connecting microelectronic circuitry.

Interlayer dielectric and pre-applied die attach adhesive materials

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El Monte, CA, United States of America

Qing Ji