The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Sep. 25, 2012
Filed:
Sep. 17, 2010
Applicants:
Chew B. Chan, Chino Hills, CA (US);
Qing Ji, Chino Hills, CA (US);
Mark Currie, Costa Mesa, CA (US);
Neil Poole, Claremont, CA (US);
Geraldine Kelly, Hemel Hempstead, GB;
Inventors:
Chew B. Chan, Chino Hills, CA (US);
Qing Ji, Chino Hills, CA (US);
Mark Currie, Costa Mesa, CA (US);
Neil Poole, Claremont, CA (US);
Geraldine Kelly, Hemel Hempstead, GB;
Assignees:
Henkel Corporation, Rocky Hill, CT (US);
Henkel Ltd, Hertforshire, GB;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 21/00 (2006.01); B05D 1/18 (2006.01);
U.S. Cl.
CPC ...
Abstract
The present invention relates to a method of fabricating a semiconductor package or circuit assembly using an fluxing underfill composition applied to solder contact points in a dip process.