Company Filing History:
Years Active: 2011-2014
Title: Chew Beng Chan: Innovator in Thermal Interface Materials
Introduction
Chew Beng Chan is a notable inventor based in Chino Hills, CA (US). He has made significant contributions to the field of thermal interface materials, holding a total of 3 patents. His work focuses on innovative solutions that enhance the performance and reliability of electronic devices.
Latest Patents
One of his latest patents is for a thermal interface material that utilizes epoxidized nutshell oil. This material comprises an epoxy resin derived from nutshell oil or an epoxidized dimer fatty acid, along with fusible metal particles that are substantially devoid of added lead. Additionally, the thermal interface material may include a catalyst for the epoxy functionality. Another significant patent involves a method of fabricating a semiconductor package using a fluxing underfill composition applied to solder balls in a dip process. This invention relates to improving the manufacturing process of semiconductor packages or circuit assemblies.
Career Highlights
Throughout his career, Chew Beng Chan has worked with prominent companies such as Henkel Corporation and Henkel US IP LLC. His experience in these organizations has allowed him to develop and refine his innovative ideas in thermal interface materials.
Collaborations
Chew has collaborated with talented individuals in his field, including Qing Ji and Hwang Kyu Yun. These partnerships have contributed to the advancement of his research and the successful development of his patents.
Conclusion
Chew Beng Chan is a distinguished inventor whose work in thermal interface materials has made a significant impact in the electronics industry. His innovative patents and collaborations highlight his commitment to advancing technology and improving manufacturing processes.