Henkel Corporation

Henkel US IP Lcc

Chew Beng Chan

Qing Ji

My Nhu Nguyen

Hwang Kyu Yun

Weitong Shi

Neil Poole

Geraldine Kelly

Mark Currie

Renzhe Zhao

A thermal interface material comprises an epoxy resin derived from nutshell oil or an epoxidized dimer fatty acid, or both, and fusible metal particles substantially devoid of added lead. Optionally, the TIM comprises a catalyst for the epoxy functionality.

Thermal interface material with epoxidized nutshell oil

The present invention relates to a method of fabricating a semiconductor package or circuit assembly using an fluxing underfill composition applied to solder contact points in a dip process.

Method of fabricating a semiconductor package using a fluxing underfill composition applied to solder balls in a dip process

This invention relates to the thermosetting resin compositions useful for mounting onto a circuit board semiconductor devices, such as chip size or chip scale packages ('CSPs'), ball grid arrays ('BGAs'), land grid arrays (&#x201c;LGAs&#x201d;) and the like, each of which having a semiconductor chip, such as large scale integration (&#x201c;LSI&#x201d;), on a carrier substrate. Similarly, the compositions are useful for mounting onto circuit board semiconductor chips themselves. Reaction products of the compositions of this invention are controllably reworkable when subjected to appropriate conditions. And significantly, unlike many commercial rapid curing underfill sealants (&#x201c;snap cure underfills&#x201d;), the inventive compositions possess an exotherm under 300 J/g or demonstrate package stability at 55&#xb0; C. for 7 days, and therefore do not require special packaging to be transported by air courier, or special approval from international transportation authorities, such as the U.S. Department of Transportation, to permit such air transport. The inventive compositions possess an exotherm under 300 J/g and/or demonstrate package stability at 55&#xb0; C. for 7 days and therefore do not require special packaging to be transported by air courier, or special approval from international transportation authorities, such as the U.S. Department of Transportation, to permit such air transport.

Low exothermic thermosetting resin compositions useful as underfill sealants and having reworkability

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Chino Hills, CA, United States of America

Chew Beng Chan