Henkel Corporation

Henkel IP Holding Gmbh

Other

Henkel Ag & Company, Kgaa

Henkel Ireland Limited

Puwei Liu

Stephen M Dershem

Kang Yang

Benedicto Delos Santos

My Nhu Nguyen

Farhad G Mizori

Tadashi Takano

James T Huneke

Matthew James Holloway

Qing Ji

Deborah Derfelt Forray

Blake Olsen

Barry N Burns

Andreas Taden

Jiangbo Ouyang

Pukun Zhu

Benjamin Neff

Kevin J Forrestal

John Killoran

Edward Ho

Alex C Wong

Eric A Parker

ChunHua Gu

Maria Villegas

Carolyn C Albino

Benedicto P Delos Santos

Provided herein are high refractive index compositions with excellent light stability, and methods for the use thereof, as well as assemblies and articles prepared using invention formulations and methods.

Light stable transparent adhesive compositions and methods for use thereof

The present invention relates to organic acid- or latent organic acid-functionalized polymer-coated metal powders, such as metal powders used as appropriate in the formation of solder alloys, spheres and pastes.

Organic acid-or latent organic acid-functionalized polymer-coated metal powders for solder pastes

Organic acid- or latent organic acid-functionalized polymer-coated metal powders for solder pastes

The present invention relates to cured products of di- or poly-functional electron deficient olefins coated onto at least a portion of a surface of metal powders, such as metal powders used as appropriate in the formation of solder alloys, spheres and pastes.

Di- or poly-functional electron deficient olefins coated metal powders for solder paste

Novel adhesive compositions that can be used in the die attach process. The adhesives include a curable resin component, a curing agent, and a block copolymer additive. The block copolymer additive has a glass transition temperature of at least about 40&#xb0; C. The block copolymer additive improves the affinity of the adhesive composition to a hydrophilic substrate, such as a silicon wafer, during the die pickup process. Also disclosed is an assembly which includes a hydrophilic substrate and a layer of adhesive and methods of producing the assembly.

Adhesive compositions for use in die attach applications

This invention relates to thermosetting resin compositions useful for flip chip ('FC') underfill sealant materials, where a semiconductor chip is mounted directly onto a circuit through solder electrical interconnections. Similarly, the compositions are useful for mounting onto a circuit board semiconductor devices, such as chip size or chip scale packages ('CSPs'), ball grid arrays (&#x201c;BGAs&#x201d;), land grid arrays (&#x201c;LGAs&#x201d;) and the like, each of which having a semiconductor chip, such as large scale integration (&#x201c;LSI&#x201d;), on a carrier substrate.

Curable resin compositions useful as underfill sealants for use with low-k dielectric-containing semiconductor devices

The present invention relates to polymer coated metal powders, such as metal powders used in the formation of solder alloys and pastes. The metal powders are coated with curable compositions of cyanoacrylates. The present invention relates to polymer coated metal powders, such as metal powders used in the formation of solder alloys and pastes. The metal powders are coated with curable compositions of cyanoacrylates, and once cured the coating on the metal powder is a cyanoacrylate polymer.

Thermally decomposable polymer coated metal powders

A curing agent for epoxy resin has one or more five- or six-membered aromatic rings, and substituted on the one or more five- or six-membered rings at least two functionalities reactive with the epoxy selected from the group consisting of hydroxyl, amine, imidazole, azine, hydrazide, anhydride, and Lewis acid groups. Choice of functionality can provide a mixed polymer network, one with a more densely cross-linked polymer structure having a high Tg, and the other with a more linear polymer structure to contribute to stress reduction.

Curing agents for epoxy resins

This invention relates to a novel synthesis for the preparation of benzoxazine components from phenolic components, aldehyde components, and amine components in a solvent other than toluene.

Method of preparing benzoxazines

The present invention relates to b-stageable die attach adhesives, methods of preparing such adhesives, methods of applying such adhesives to the die and other substrate surfaces, and assemblies prepared therewith for connecting microelectronic circuitry.

B-stageable die attach adhesives

The present invention relates to interlayer dielectric materials and pre-applied die attach adhesives, more specifically pre-applied die attach adhesives (such as wafer and other substrate-applied die attach adhesives), methods of applying the interlayer dielectric materials onto substrates to prepare low K dielectric semiconductor chips, methods of applying the pre-applied die attach adhesives onto wafer and other substrate surfaces, and assemblies prepared therewith for connecting microelectronic circuitry.

Interlayer dielectric and pre-applied die attach adhesive materials

In accordance with the present invention, there are provided novel benzoxazine compounds and thermosetting resin compositions prepared therefrom. Invention compositions are particularly useful for increasing adhesion at interfaces within microelectronic packages. Invention benzoxazines are useful for the preparation of invention compositions with properties which are associated with increased adhesion at interfaces, such as, for example, low shrinkage on cure and low coefficient of thermal expansion (CTE). In another aspect of the invention, there are provided die-attach pastes having increased interfacial adhesion. Invention die-attach pastes include benzoxazine-containing thermosetting resin compositions. In further aspects of the invention, there are provided methods for enhancing adhesive strength of thermosetting resin compositions and methods for enhancing adhesion of a substrate bound to a metallic surface by a thermosetting resin composition.

Benzoxazines, thermosetting resins comprised thereof, and methods for use thereof

In accordance with the present invention, there are provided novel coupling agents which are compatible with a wide variety of adhesive formulations and which provide substantial adhesion enhancement relative to base formulations to which they are added. Invention compounds comprise at least one free-radically polymerizable group (other than acrylate) and at least one reactive moiety which forms covalent bond(s) with substrates having free hydroxyl groups on the surface thereof. Thus, invention compounds are covalently linked to adhesive formulations upon free radical cure, while at the same time providing 'residual' functionality which is capable of undergoing reaction with any substrate having reactive (e.g., hydroxyl) groups in the surface thereof.

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San Diego, CA, United States of America

Puwei Liu