The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Nov. 27, 2018
Filed:
Jun. 23, 2017
Applicants:
Henkel Ag & Co. Kgaa, Duesseldorf, DE;
Henkel Ip & Holding Gmbh, Duesseldorf, DE;
Inventors:
Hajime Inoue, Yokohama, JP;
Tadashi Takano, Yokohama, JP;
Assignees:
Henkel AG & Co. KGaA, Duesseldorf, DE;
Henkel IP & Holding GmbH, Duesseldorf, DE;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 21/00 (2006.01); H01L 23/00 (2006.01); B22F 1/00 (2006.01); H05K 3/32 (2006.01);
U.S. Cl.
CPC ...
H01L 24/29 (2013.01); B22F 1/0055 (2013.01); B22F 1/0059 (2013.01); H01L 24/32 (2013.01); H01L 24/83 (2013.01); H01L 2224/04026 (2013.01); H01L 2224/05639 (2013.01); H01L 2224/05644 (2013.01); H01L 2224/05647 (2013.01); H01L 2224/05655 (2013.01); H01L 2224/29294 (2013.01); H01L 2224/29339 (2013.01); H01L 2224/32245 (2013.01); H01L 2224/8321 (2013.01); H01L 2224/8384 (2013.01); H01L 2224/83192 (2013.01); H01L 2224/83411 (2013.01); H01L 2224/83439 (2013.01); H01L 2224/83444 (2013.01); H01L 2224/83455 (2013.01); H05K 3/32 (2013.01); H05K 2203/1131 (2013.01);
Abstract
An objective of the present invention is to provide a sinterable bonding material excellent in sinterability. The present invention relates to a sinterable bonding material comprising a silver filler and an organic base compound as a sintering promoter.