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Seongnam-si, South Korea

Sung-min Sim

USPTO Granted Patents = 7

Average Co-Inventor Count = 5.6

ph-index = 4

Forward Citations = 363(Granted Patents)

Location History:

Suwon, KR (1996)
Seongnam-si, KR (2006 - 2010)

Company Filing History:

7 out of 131,214

Samsung Electronics Co., Ltd.

Years Active: 1996-2010

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7 patents (USPTO):Sort by Forward CitationsExplore Patents

1. 7855144 - Method of forming metal lines and bumps for semiconductor devices (2010-12-21),

2. 7825495 - Semiconductor chip structure, method of manufacturing the semiconductor chip structure, semiconductor chip package, and method of manufacturing the semiconductor chip package (2010-11-02),

3. 7524763 - Fabrication method of wafer level chip scale packages (2009-04-28),

4. 7312143 - Wafer level chip scale package having a gap and method for manufacturing the same (2007-12-25),

5. 7205660 - Wafer level chip scale package having a gap and method for manufacturing the same (2007-04-17),

6. 7151009 - Method for manufacturing wafer level chip stack package (2006-12-19),

7. 5543493 - Method for treating a polyimide surface (1996-08-06),

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