The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Dec. 21, 2010
Filed:
Oct. 31, 2006
Soon-bum Kim, Suwon-si, KR;
Sung-min Sim, Seongnam-si, KR;
Dong-hyeon Jang, Suwon-si, KR;
Jae-sik Chung, Yongin-si, KR;
Se-yong OH, Seoul, KR;
Soon-bum Kim, Suwon-si, KR;
Sung-min Sim, Seongnam-si, KR;
Dong-hyeon Jang, Suwon-si, KR;
Jae-sik Chung, Yongin-si, KR;
Se-yong Oh, Seoul, KR;
Samsung Electronics Co., Ltd., Gyeonggi-do, KR;
Abstract
Provided is a method of forming conductors (e.g., metal lines and/or bumps) for semiconductor devices and conductors formed from the same. First and second seed metal layers may be formed. At least one mask may be formed on a portion on which a conductor is to be formed. An exposed portion may be oxidized. The oxidized portion may be removed. A conductive structure may be formed on an upper surface of a portion which is not oxidized. The conductors may be metal lines and/or bumps. The conductive structures may be solder balls.