Suguru Hirokawa

Title: Suguru Hirokawa: Innovator in Wafer Technology

Introduction

Suguru Hirokawa is a notable inventor based in Ehime, Japan, recognized for his contributions to wafer technology. He holds a total of four patents, showcasing his innovative approach in the field of semiconductor manufacturing.

Latest Patents

Hirokawa's latest patents include a wafer holding device and a wafer chucking and dechucking method. This wafer holding device features a wafer chuck with a holding surface that contacts the wafer and includes multiple attraction regions. A controller independently manages the attraction force of these regions. When the wafer's fixing is released, the controller establishes a temporarily fixing state with reduced attraction force, ensuring a smooth transition. Another significant patent is for an ion implantation apparatus and its control method. This apparatus consists of a vacuum processing chamber for ion implantation, load lock chambers for wafer transfer, and an intermediate conveyance chamber. It includes mechanisms for communication between these chambers, enhancing the efficiency of the ion implantation process.

Career Highlights

Hirokawa has worked with prominent companies in the industry, including Sumitomo Heavy Industries Ion Technology Co., Ltd. and Sumitomo Eaton Nova Corporation. His experience in these organizations has contributed to his expertise in wafer technology and ion implantation processes.

Collaborations

Throughout his career, Hirokawa has collaborated with notable colleagues such as Keiji Okada and Fumiaki Sato. These partnerships have likely fostered innovation and advancements in their shared field.

Conclusion

Suguru Hirokawa's work in wafer technology and ion implantation has made a significant impact on the semiconductor industry. His patents reflect a commitment to innovation and efficiency in manufacturing processes.