Sou Miyata

Title: Sou Miyata: Innovator in High-Frequency Dielectric Heating Adhesives

Introduction

Sou Miyata is a prominent inventor based in Matsudo, Japan. He has made significant contributions to the field of adhesive technology, particularly in high-frequency dielectric heating applications. With a total of 12 patents to his name, Miyata's work has advanced the capabilities of adhesive sheets used in various industrial applications.

Latest Patents

Miyata's latest patents include a high-frequency dielectric heating adhesive sheet. This innovative adhesive sheet consists of a first bonding layer containing a first thermoplastic resin and a first dielectric filler, along with a second bonding layer containing a second thermoplastic resin and a second dielectric filler. The volume content of the thermoplastic resins in both layers is maintained between 60% and 100% by volume. Additionally, the change rates represented by specific formulas are kept below 80%, ensuring optimal performance in bonding applications. Another notable patent involves a method of bonding with adhesive sheets for high-frequency dielectric heating, which utilizes high-frequency waves to effectively bond adherends together.

Career Highlights

Throughout his career, Sou Miyata has worked with notable companies such as Lintec Corporation and Sony Corporation. His experience in these organizations has allowed him to refine his skills and contribute to groundbreaking innovations in adhesive technology.

Collaborations

Miyata has collaborated with talented individuals in the field, including Kazuya Katoh and Shin Kubota. These partnerships have fostered a creative environment that has led to the development of advanced adhesive solutions.

Conclusion

Sou Miyata's contributions to adhesive technology, particularly in high-frequency dielectric heating applications, have established him as a key figure in the industry. His innovative patents and collaborations continue to influence the field, paving the way for future advancements.