The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Apr. 22, 2014
Filed:
Jan. 27, 2012
Isao Ichikawa, Tokyo, JP;
Masaaki Furudate, Tokyo, JP;
Mikihiro Kashio, Chiba, JP;
Sou Miyata, Chiba, JP;
Kaisuke Yanagimoto, Saitama, JP;
Yuichi Kozone, Saitama, JP;
Isao Ichikawa, Tokyo, JP;
Masaaki Furudate, Tokyo, JP;
Mikihiro Kashio, Chiba, JP;
Sou Miyata, Chiba, JP;
Kaisuke Yanagimoto, Saitama, JP;
Yuichi Kozone, Saitama, JP;
LINTEC Corporation, Tokyo, JP;
Abstract
An adhesive composition for a semiconductor includes an acrylic polymer (A), an epoxy-based heat curable resin (B), a heat curing agent (C), a silane compound (D) having an organic functional group, molecular weight of 300 or more and an alkoxy equivalent of larger than 13 mmol/g, and a silane compound (E) having an organic functional group, molecular weight of 300 or less and an alkoxy equivalent of 13 mmol/g or less.