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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 12359096 B1

PDFFull Text
Date of Patent:
Jul. 15, 2025

Filed:

Mar. 26, 2021

High-frequency dielectric heating adhesive sheet

Applicant:

Lintec Corporation, Tokyo, JP;

Inventors:

Naoki Taya, Tokyo, JP;

Sou Miyata, Tokyo, JP;

Assignee:

LINTEC CORPORATION, Tokyo, JP;

Attorney:

Rimon P.C.

Primary Examiner:

S Behrooz Ghorishi

Int. Cl.
CPC ...
C09J 7/30 (2018.01); B32B 27/08 (2006.01); B32B 27/20 (2006.01); B32B 27/30 (2006.01); B32B 27/32 (2006.01); B32B 27/36 (2006.01); C08K 3/22 (2006.01); C09J 9/02 (2006.01); C09J 11/04 (2006.01); C09J 123/12 (2006.01); C09J 125/08 (2006.01); C09J 133/12 (2006.01); H05B 6/46 (2006.01);
U.S. Cl.
CPC ...
C09J 7/30 (2018.01); B32B 27/08 (2013.01); B32B 27/20 (2013.01); B32B 27/302 (2013.01); B32B 27/32 (2013.01); B32B 27/36 (2013.01); C09J 9/02 (2013.01); C09J 11/04 (2013.01); C09J 123/12 (2013.01); C09J 125/08 (2013.01); C09J 133/12 (2013.01); H05B 6/46 (2013.01); B32B 2264/1025 (2020.08); B32B 2264/303 (2020.08); B32B 2270/00 (2013.01); B32B 2307/204 (2013.01); B32B 2307/30 (2013.01); B32B 2307/748 (2013.01); B32B 2405/00 (2013.01); C08K 2003/2296 (2013.01); C08K 2201/001 (2013.01); C08K 2201/005 (2013.01); C09J 2301/314 (2020.08); C09J 2301/408 (2020.08); C09J 2423/10 (2013.01); C09J 2425/00 (2013.01); C09J 2433/00 (2013.01);
Abstract

A high-frequency dielectric heating adhesive sheet includes: a first bonding layer containing a first thermoplastic resin and a first dielectric filler; and a second bonding layer containing a second thermoplastic resin and a second dielectric filler. A volume content VA1 of the first thermoplastic resin in the first bonding layer and a volume content VA2 of the second thermoplastic resin in the second bonding layer are in a range from 60% by volume to 100% by volume. Change rates Vx1 and Vx2 represented by formulas below are less than 80%. VB1 is the volume content of the first thermoplastic resin in a layer in direct contact with the first bonding layer, and VB2 is the volume content of the second thermoplastic resin in a layer in direct contact with the second bonding layer. (Formula 1): Vx1={(VA1−VB1)/VA1}×100 (Formula 2): Vx2={(VA2−VB2)/VA2}×100

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