Lintec Corporation

Sony Corporation

Panasonic Corporation

National Institute of Advanced Industrial Science and Technology

Sou Miyata

Kazuya Katoh

Shin Kubota

Ryo Takahashi

Masaharu Ito

Takeshi Kondo

Tomoo Orui

Shinichi Hoshi

Naoki Taya

Yoshitomo Ono

Maki Hironaga

Takeshi Yamasaki

Mikihiro Kashio

Kazuhiro Hayashi

Toshio Sugizaki

Tomomi Yukumoto

Keiji Nishikiori

Isao Ichikawa

Yumiko Amino

Takashi Sugino

Atsushi Hozumi

Takuo Nishida

Chihiro Urata

Yutaka Nanashima

Masaaki Furudate

Yuichi Kozone

Kaisuke Yanagimoto

Kazumi Ito

Shin 3-24-36-403 Hiyoshihon-Cho Kubota

A high-frequency dielectric heating adhesive sheet includes: a first bonding layer containing a first thermoplastic resin and a first dielectric filler; and a second bonding layer containing a second thermoplastic resin and a second dielectric filler. A volume content VA1 of the first thermoplastic resin in the first bonding layer and a volume content VA2 of the second thermoplastic resin in the second bonding layer are in a range from 60% by volume to 100% by volume. Change rates Vx1 and Vx2 represented by formulas below are less than 80%. VB1 is the volume content of the first thermoplastic resin in a layer in direct contact with the first bonding layer, and VB2 is the volume content of the second thermoplastic resin in a layer in direct contact with the second bonding layer. (Formula 1): Vx1={(VA1−VB1)/VA1}×100 (Formula 2): Vx2={(VA2−VB2)/VA2}×100

High-frequency dielectric heating adhesive sheet

A bonding method using adhesive sheets respectively containing first and second thermoplastic resins. The volume content VA1 of the first thermoplastic resin in the adhesive sheet and the volume content VA2 of the second thermoplastic resin in the adhesive sheet are from 60 vol % to 100 vol %. Change rates Vx1 and Vx2 represented by formulae below are less than 80%. VB1 is the volume content of the first thermoplastic resin in a layer in direct contact with the first adhesive layer, and VB2 is the volume content of the second thermoplastic resin in a layer in direct contact with the second adhesive layer. The method includes applying a high-frequency wave to the adhesive sheets between adherends to bond them together,1={(11)/1}×100  (Numerical Formula 1)2={(2-2)/2}×100  (Numerical Formula 2).

Method of bonding with adhesive sheets for high-frequency dielectric heating

Provided is an antifouling composition including a tetrafunctional silane-based compound (A) having a specified structure, a trifunctional silane-based compound having a specified structure, and at least one metal catalyst (C) selected from the group consisting of a titanium-based catalyst, an aluminum-based catalyst, a tin-based catalyst, and a zinc-based catalyst, the antifouling composition satisfying the following relational expression (1).1.5&#x2264;&#x2264;2+1&#x2003;&#x2003;Expression (1): In the expression, x indicates the carbon number of an alkyl group that is selected for Rin the formula (b) representing the silane-based compound (B) and indicates a number of 4 to 22; and y indicates a blending amount ratio (A)/(B) in a molar ratio of the silane-based compound (A) to the silane-based compound (B).

Anti-fouling composition, and anti-fouling sheet

Provided is an antifouling composition including a polysilazane-based compound (A) and a both terminal carboxy-modified silicone (B), the content of the component (B) being from 0.01 to 10 parts by mass based on 100 parts by mass of the total amount of the component (A), and the antifouling composition serves as a sheet-like antifouling layer-forming material. The antifouling composition is able to form a sheet-like antifouling layer having favorable surface state and curability and also having excellent water repellency such that even when a tilt angle is small, water droplets can be slipped off.

Antifouling composition, antifouling sheet, and method for manufacturing antifouling sheet

An adhesive composition for a semiconductor includes an acrylic polymer (A), an epoxy-based heat curable resin (B), a heat curing agent (C), a silane compound (D) having an organic functional group, molecular weight of 300 or more and an alkoxy equivalent of larger than 13 mmol/g, and a silane compound (E) having an organic functional group, molecular weight of 300 or less and an alkoxy equivalent of 13 mmol/g or less.

Adhesive compositions for a semiconductor, an adhesive sheet for a semiconductor and a production method of a semiconductor device

A film for producing a sheet for a multilayer optical recording medium, the sheet having a repeating structure containing a plurality of laminated optical recording layers, the sheet has a structure including a unit wherein an optical recording layer and an adhesive layer are laminated or a structure including a unit wherein an optical recording layer, a barrier layer and an adhesive layer are laminated, and a maximum height roughness of the optical recording layer or the barrier layer is 500 nm or smaller, the optical recording layer or the barrier layer is disposed on a process film on a face at a side for forming the optical recording layer or at a side for forming the barrier layer, the face at the side for forming the optical recording layer or at the side for forming the barrier layer having a maximum height roughness of 500 nm or smaller.

Film for producing a sheet for a multilayer optical recording medium

Disclosed is a sheet for producing a multilayer optical recording medium having a repeating structure wherein a plurality of optical recording layers are laminated. The sheet for a multilayer optical recording medium has a structure having a unit wherein an optical recording layer and an adhesive layer are laminated, or a structure having a unit wherein an optical recording layer, a barrier layer and an adhesive layer are laminated in this order. The maximum height roughness (Rz) of the optical recording layer or the barrier layer is not more than 500 nm. A multilayer optical recording medium is produced by using the sheet for a multilayer optical recording medium. Also disclosed is a sheet for producing, with high precision, a high-quality multilayer optical recording medium having a repeating unit wherein a plurality of optical recording layers containing a multiphoton absorbing material are laminated. A multilayer optical recording medium is also produced by using this sheet.

Sheet for multilayer optical recording medium and multilayer optical recording medium using the same

A transparent protective layer () having a thickness of 100 &#x3bc;m is formed of a resin film (), a boundary layer () and an adhesive layer () on a signal recording layer (). When nf, ni and na are the indices of refraction of the resin film (), the boundary layer () and the adhesive layer (), respectively, the relationship among nf, ni, and na satisfies any one of the following equation: na&#x3c;ni&#x2266;nf; na&#x3e;ni&#x2267;nf; na&#x3c;nf&#x2266;ni; or na&#x3e;nf&#x2267;ni, and the relationship among nf, ni, and na satisfies the following equation |nf&#x2212;ni|&#x3c;|nf&#x2212;na|. At this time, a protrusion () and a scratch () are optically buried within the boundary layer (), reducing scattering of laser beams and disturbance in the wave front which occur in these portions, and thereby, the error rate can be reduced.

Optical information recording medium and method for manufacturing the same

The present invention provides an optical disk producing sheet, obtained by laminating a stamper-receiving layerthat is energy rays-curable and whose storage elastic modulus prior to curing is from 10to 10Pa, and an adhesive layerwhose adhesive strength to polycarbonate is at least 200 mN/25 mm, and whose storage elastic modulus during the curing of the stamper-receiving layeris from 10to 10Pa. With the optical disk producing sheet, separation that occurs during the production of an optical disk, or during the storage of the finished product, is prevented, and warpage in the resulting optical disk is reduced.

Optical disk manufacturing sheet

A curable pressure sensitive adhesive composition is made to contain a polymer-containing energy rays-curable component and fine particles having an average particle diameter of not more than 30 nm, wherein the solid content of the fine particles is made to be from 5 to 60 wt %. A stamper-receiving layer or a curable pressure sensitive adhesive layer for bonding a protective layer is formed using this curable pressure sensitive adhesive composition, thus producing an optical disk producing sheet. This optical disk producing sheet has a low volume shrinkage rate upon curing, and has excellent adhesiveness. If this optical disk producing sheet is used, then an optical disk having little warping and excellent inter-layer adhesion can be obtained.

Curable pressure sensitive adhesive composition, optical disk producing sheet, and optical disk

Provided is a release sheet which is non-silicone-based and has a good releasability from a layer of a pressure sensitive adhesive and which has a stable antistatic property without being influenced by the air environment and is free of bleeding out of ionic substances derived from an antistatic agent. The release sheet is prepared by providing an undercoat layer containing a polyurethane-based resin and 0.1 to 45% by mass of a lithium salt-based antistatic agent and a layer of a rubber-based release agent formed by coating and drying a liquid containing a release agent in order on a substrate.

Release sheet

An optical disc-producing sheet, which has an adhesive layerhaving a specific heat capacity after curing of not more than 1.9 J/g&#xb7;&#xb0; C. at 80&#xb0; C. and a protective sheet, is laminated onto an information recording layer(a laminate of a reflecting layer, a dielectric layer, a phase change layerand a dielectric layer') formed on an optical recording medium substrate. According to this optical disc, recorded information can be reproduced accurately even in the case that recording/erasure or reproduction of information has been carried out repeatedly.

Growing community of inventors

Matsudo, Japan

Sou Miyata