The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jun. 03, 2025
Filed:
Mar. 26, 2021
Lintec Corporation, Tokyo, JP;
Naoki Taya, Tokyo, JP;
Sou Miyata, Tokyo, JP;
LINTEC CORPORATION, Tokyo, JP;
Abstract
A bonding method using adhesive sheets respectively containing first and second thermoplastic resins. The volume content VA1 of the first thermoplastic resin in the adhesive sheet and the volume content VA2 of the second thermoplastic resin in the adhesive sheet are from 60 vol % to 100 vol %. Change rates Vx1 and Vx2 represented by formulae below are less than 80%. VB1 is the volume content of the first thermoplastic resin in a layer in direct contact with the first adhesive layer, and VB2 is the volume content of the second thermoplastic resin in a layer in direct contact with the second adhesive layer. The method includes applying a high-frequency wave to the adhesive sheets between adherends to bond them together,1={(11)/1}×100 (Numerical Formula 1)2={(2-2)/2}×100 (Numerical Formula 2).