Yokkaichi, Japan

Shunsuke Takuma

This inventor holds 12 USPTO granted patents and 1 published patent application. Top assignee: Sandisk Technologies Inc.. Active years: 2019-2026.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Shunsuke Takuma. Retrieved from https://idiyas.com/inventor/shunsuke-takuma

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

USPTO Granted Patents = 12 

% Patents Active = 83.3

Average Co-Inventor Count = 3.4

ph-index = 2

Forward Citations = 18(Granted Patents)


Company Filing History:


Years Active: 2019-2026

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12 patents (USPTO):Explore Patents

Title: Shunsuke Takuma: Innovator in Three-Dimensional Memory Devices

Introduction

Shunsuke Takuma is a prominent inventor based in Yokkaichi, Japan. He has made significant contributions to the field of memory devices, holding a total of 12 patents. His innovative work focuses on enhancing the performance and efficiency of memory technology.

Latest Patents

Among his latest patents, Takuma has developed a three-dimensional memory device with backside support pillar structures. This invention involves forming at least one vertically alternating sequence of continuous insulating layers and sacrificial material layers over a substrate. Rows of backside support pillar structures are created through this sequence, allowing for the formation of memory stack structures. Additionally, a two-dimensional array of discrete backside trenches is established, which, in combination with the backside support pillar structures, divides the sequence into alternating stacks of insulating and sacrificial material layers. The sacrificial layers are then replaced with electrically conductive layers, while the backside support pillar structures provide essential structural support.

Another notable patent is a three-dimensional memory device that includes a dummy word line with a tapered corner. This device features at least one alternating stack of insulating layers and electrically conductive layers, along with a memory opening that extends vertically through the stack. The memory opening fill structure contains a vertical stack of memory elements and a vertical semiconductor channel, with a lateral protrusion that has a tapered sidewall surface. One of the electrically conductive layers is designed to contain a taper, aligning with the lateral protrusion of the memory opening fill structure.

Career Highlights

Shunsuke Takuma is currently employed at Sandisk Technologies Inc., where he continues to push the boundaries of memory technology. His work has been instrumental in advancing the capabilities of three-dimensional memory devices, making them more efficient and reliable.

Collaborations

Throughout his career, Takuma has collaborated with notable colleagues, including Seiji Shimabukuro and Tatsuya Hinoue. These partnerships have fostered a creative environment that has led to groundbreaking innovations in the field.

Conclusion

Shunsuke Takuma's contributions to the field of memory devices are significant and impactful. His innovative patents and collaborative efforts continue to shape the future of memory technology.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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