The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Sep. 05, 2023

Filed:

Nov. 05, 2020
Applicant:

Sandisk Technologies Llc, Addison, TX (US);

Inventors:

Makoto Tsutsue, Yokkaichi, JP;

Shunsuke Takuma, Yokkaichi, JP;

Assignee:

SANDISK TECHNOLOGIES LLC, Addison, TX (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 21/02 (2006.01); H01L 21/687 (2006.01); C23C 16/455 (2006.01); H01L 21/67 (2006.01);
U.S. Cl.
CPC ...
H01L 21/68735 (2013.01); C23C 16/45536 (2013.01); H01L 21/02057 (2013.01); H01L 21/02082 (2013.01); H01L 21/67161 (2013.01);
Abstract

A multi-wafer deposition tool includes a vacuum enclosure including a platen laterally surrounding multiple wafer stages, a spindle-blade assembly including a spindle and multiple transfer blades attached to the spindle, and a controller configured to transfer wafers between the multiple wafer stages through rotation of the multiple transfer blades around a rotation axis pasting through the spindle. A chamber clean process may be performed while the transfer blades of the spindle-blade assembly are positioned over the multiple wafer stages. Alternatively or additionally, a deposition cycle may be performed while the transfer blades of the spindle-blade assembly are positioned between neighboring pairs of the wafer stages and while a purge gas that flows out of purge gas openings into spaces between the wafer stages.


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