Tokyo, Japan

Shinichi Ogata

USPTO Granted Patents = 9 

 

Average Co-Inventor Count = 3.5

ph-index = 3

Forward Citations = 19(Granted Patents)


Company Filing History:


Years Active: 1996-2019

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9 patents (USPTO):Explore Patents

Title: The Innovations of Shinichi Ogata

Introduction

Shinichi Ogata is a prominent inventor based in Tokyo, Japan. He has made significant contributions to the field of polishing technologies, particularly in the semiconductor industry. With a total of nine patents to his name, Ogata's work has had a substantial impact on the efficiency and effectiveness of silicon wafer polishing.

Latest Patents

Among his latest patents is a polishing composition and polishing method that does not contain abrasives. This innovative polishing composition is specifically designed for use on silicon wafers and includes a pH buffer, a polishing accelerator, a water-soluble polymer, and a block-type compound. By utilizing this composition, a polishing speed greater than 0.1 µm/min can be achieved. Another notable patent is a method and apparatus for polishing a workpiece, where the temperature of a carrier plate is measured to accurately control the amount of polishing removal based on changes in the measured temperature.

Career Highlights

Throughout his career, Ogata has worked with several notable companies, including Sumco Corporation and Kirin Beer Kabushiki Kaisha. His experience in these organizations has allowed him to refine his skills and contribute to advancements in polishing technologies.

Collaborations

Some of his coworkers include Ryuichi Tanimoto and Shunsuke Mikuriya, who have collaborated with him on various projects, further enhancing the innovation landscape in which Ogata operates.

Conclusion

Shinichi Ogata's contributions to polishing technologies have established him as a key figure in the industry. His innovative patents and collaborations reflect his commitment to advancing the field and improving processes in semiconductor manufacturing.

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