The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jan. 13, 2015
Filed:
Mar. 23, 2011
Applicants:
Shinichi Ogata, Tokyo, JP;
Ryuichi Tanimoto, Tokyo, JP;
Ichiro Yamasaki, Tokyo, JP;
Shunsuke Mikuriya, Tokyo, JP;
Inventors:
Shinichi Ogata, Tokyo, JP;
Ryuichi Tanimoto, Tokyo, JP;
Ichiro Yamasaki, Tokyo, JP;
Shunsuke Mikuriya, Tokyo, JP;
Assignee:
Sumco Corporation, Tokyo, JP;
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 21/302 (2006.01); H01L 21/02 (2006.01); B24B 37/08 (2012.01); B24B 37/24 (2012.01); B24B 37/04 (2012.01); B24B 37/28 (2012.01);
U.S. Cl.
CPC ...
H01L 21/02024 (2013.01); B24B 37/08 (2013.01); B24B 37/245 (2013.01); B24B 37/044 (2013.01); B24B 37/28 (2013.01);
Abstract
Disclosed is a method for polishing a silicon wafer, wherein a surface to be polished of a silicon wafer is rough polished, while supplying a polishing liquid, which is obtained by adding a water-soluble polymer to an aqueous alkaline solution that contains no free abrasive grains, to a polishing cloth. Consequently, the surface to be polished can be polished at high polishing rate and the flatness of the edge portion including roll-off and roll-up can be controlled.