The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
May. 20, 2014

Filed:

Aug. 20, 2010
Applicants:

Shinichi Ogata, Tokyo, JP;

Kazushige Takaishi, Tokyo, JP;

Hironori Nishimura, Tokyo, JP;

Shigeru Okuuchi, Tokyo, JP;

Shunsuke Mikuriya, Tokyo, JP;

Yuichi Nakayoshi, Tokyo, JP;

Inventors:

Shinichi Ogata, Tokyo, JP;

Kazushige Takaishi, Tokyo, JP;

Hironori Nishimura, Tokyo, JP;

Shigeru Okuuchi, Tokyo, JP;

Shunsuke Mikuriya, Tokyo, JP;

Yuichi Nakayoshi, Tokyo, JP;

Assignee:

Sumico Corporation, Tokyo, JP;

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 21/302 (2006.01);
U.S. Cl.
CPC ...
Abstract

Mirror-polishing a front surface of a silicon wafer using polishing liquid composed of an abrasive grain-free alkaline solution including water-soluble polymers simplifies a polishing process, thus leading to an increase in productivity and a reduction in cost, and reduces the density of LPDs attributable to processing and occurring in the front surface of a mirror-polished wafer, thus improving the surface roughness of the wafer front surface.


Find Patent Forward Citations

Loading…