Tokyo, Japan

Hironori Nishimura

This inventor holds 2 USPTO granted patents and 2 published patent applications. Top assignees: Sumco Corporation, Sumico Corporation. Active years: 2012-2014.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Hironori Nishimura. Retrieved from https://idiyas.com/inventor/hironori-nishimura

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

USPTO Granted Patents = 2 

% Patents Active = 100.0

Average Co-Inventor Count = 4.0

ph-index = 1

Forward Citations = 6(Granted Patents)


Company Filing History:


Years Active: 2012-2014

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2 patents (USPTO):Explore Patents

Title: Hironori Nishimura: Innovator in Silicon Wafer Technology

Introduction

Hironori Nishimura is a notable inventor based in Tokyo, Japan. He has made significant contributions to the field of silicon wafer technology, holding 2 patents that enhance the efficiency and quality of silicon wafer production.

Latest Patents

One of his latest patents is a method for producing epitaxial silicon wafers. This innovative method involves mirror-polishing the front surface of a silicon wafer using a polishing liquid composed of an abrasive grain-free alkaline solution that includes water-soluble polymers. This approach simplifies the polishing process, leading to increased productivity and reduced costs. Additionally, it minimizes the density of LPDs (Light Point Defects) that occur during processing, thereby improving the surface roughness of the wafer's front surface.

Another significant patent is related to a polishing pad thickness measuring method and device. This method measures the thickness of a polishing pad attached to the upper surface of a surface plate. It calculates the thickness by measuring the distance between the upper surface of the polishing pad and a reference position, as well as the distance between the upper surface of the surface plate and the same reference position. The difference between these two measurements provides the thickness of the polishing pad.

Career Highlights

Hironori Nishimura has worked with prominent companies in the semiconductor industry, including Sumco Corporation and Sumico Corporation. His experience in these organizations has allowed him to develop and refine his innovative techniques in silicon wafer production.

Collaborations

Some of his notable coworkers include Yuichi Nakayoshi and Hiroshi Takai. Their collaboration has contributed to advancements in the field of silicon wafer technology.

Conclusion

Hironori Nishimura's contributions to silicon wafer technology through his patents demonstrate his commitment to innovation and efficiency in the semiconductor industry. His work continues to influence the production processes and quality of silicon wafers.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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