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For the Inventor, By the Inventor

Jhubei, Taiwan

Shih-Ho Lin

This inventor holds 24 USPTO granted patents and 2 published patent applications, primarily in Chemical Mechanical Polishing. Top assignees: Taiwan Semiconductor Manufacturing Comp. Ltd., Other. Active years: 2006-2025.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Shih-Ho Lin. Retrieved from https://idiyas.com/inventor/shih-ho-lin

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

Calculating rank
USPTO Granted Patents = 24 

% Patents Active = 79.2

Average Co-Inventor Count = 5.9

ph-index = 4

Forward Citations = 44(Granted Patents)


Location History:

  • Hsin-Chu, TW (2006 - 2007)
  • Tainan, TW (2007 - 2012)
  • Zhubei, TW (2021 - 2023)
  • Hsinchu County, TW (2023)
  • Jhubei, TW (2006 - 2024)

Company Filing History:

goldMedal23 out of 42,965 
 
Taiwan Semiconductor Manufacturing Comp. Ltd.
 patents
silverMedal1 out of 834,601 
Other
 patents

Years Active: 2006-2025

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Areas of Expertise:
Vacuum Assembly
Chemical Mechanical Polishing
Magnetic Tunnel Junction
Semiconductor Device Structure
Electropolishing
Copper Metallization
Article Transporter
Current-Leveling Electroplating
Post-CMP Cleaning
Polishing Process
Wafer Surface Cleaning
Barrier Layer Formation
24 patents (USPTO):Explore Patents
1. 12409529 - Vacuum assembly for chemical mechanical polishing (2025-09-09),
2. 12154608 - Magnetic tunnel junction device and method of forming same (2024-11-26),
3. 12076831 - Chemical mechanical polishing apparatus and method (2024-09-03),
4. 12009222 - Method for forming semiconductor device structure (2024-06-11),
5. 11990167 - Magnetic tunnel junction device and method of forming same (2024-05-21),
6. 11685015 - Method and system for performing chemical mechanical polishing (2023-06-27),
7. 11673223 - Chemical mechanical polishing method (2023-06-13),
8. 11292101 - Chemical mechanical polishing apparatus and method (2022-04-05),
9. 11251063 - Article transporter in semiconductor fabrication (2022-02-15),
10. 11239092 - Method for forming semiconductor device structure (2022-02-01),
11. 11094554 - Polishing process for forming semiconductor device structure (2021-08-17),
12. 11043251 - Magnetic tunnel junction device and method of forming same (2021-06-22),
13. 10843307 - Vacuum assembly for chemical mechanical polishing (2020-11-24),
14. 10804133 - Article transferring method in semiconductor fabrication (2020-10-13),
15. 10636673 - Method for forming semiconductor device structure (2020-04-28),

Title: The Innovative Journey of Inventor Shih-Ho Lin

Introduction: Shih-Ho Lin, a talented female inventor hailing from Jhubei, Taiwan, has made significant contributions to the world of innovation with her creative ideas and groundbreaking inventions.

Latest Patents: Shih-Ho Lin's latest patents include a revolutionary eco-friendly packaging solution that has garnered attention for its sustainability and practicality in the current market.

Career Highlights: Throughout her illustrious career, Shih-Ho Lin has been recognized for her out-of-the-box thinking and ability to transform simple concepts into game-changing inventions. Her dedication to pushing the boundaries of traditional design has led to the creation of products that have improved the lives of many.

Collaborations: Shih-Ho Lin has collaborated with various research institutions and universities to further her research and development efforts. These partnerships have allowed her to explore new technologies and expand her innovative capabilities.

Conclusion: In conclusion, Shih-Ho Lin's passion for innovation and commitment to creating meaningful solutions have solidified her reputation as a pioneering inventor in the industry. Her work continues to inspire future generations of inventors to think boldly and pursue their creative visions.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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