Suwon, South Korea

Shaofeng Ding

This inventor holds 27 USPTO granted patents and 10 published patent applications, primarily in Semiconductor Devices. Top assignees: Samsung Electronics Co., Ltd., Samsung Electronics Ltd.. Active years: 2017-2026.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Shaofeng Ding. Retrieved from https://idiyas.com/inventor/shaofeng-ding

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

USPTO Granted Patents = 27 

% Patents Active = 88.9

Average Co-Inventor Count = 3.2

ph-index = 3

Forward Citations = 24(Granted Patents)


Location History:

  • Seongnam-si, KR (2023)
  • Suwon-si, KR (2017 - 2024)

Company Filing History:


Years Active: 2017-2026

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Areas of Expertise:
Semiconductor Device
Interposer Structure
3D Integrated Circuit
Metal-Insulator-Metal Capacitor
Semiconductor Package
Stacked Semiconductor Chips
Fabrication Method
Capacitor Structure
Thin Film Resistor
Through Contacts
Buffer Structure
Test Structure
27 patents (USPTO):Explore Patents

Title: **Shaofeng Ding: Innovating Semiconductor Technology from Suwon-si, South Korea**

Introduction

Shaofeng Ding is a prominent inventor based in Suwon-si, South Korea, known for his significant contributions to semiconductor technology. With a remarkable 21 patents to his name, Ding has played an essential role in advancing the capabilities of semiconductor devices, which are critical in the electronics industry.

Latest Patents

Ding's latest innovations showcase his expertise in semiconductor devices and their configurations. One of his notable patents focuses on a semiconductor device that incorporates a substrate equipped with an integrated circuit, a contact, and an interlayer dielectric layer. This design features a through electrode that penetrates both the substrate and the interlayer dielectric layer, enhancing the overall performance and efficiency of the device.

Another key patent involves a semiconductor chip that includes a device layer housing transistors along with a wiring layer. It introduces innovative through vias, allowing for better connectivity and integration of the various components. The distinct design where the first through via has a height less than the second through via exemplifies the inventive steps Ding has taken to improve semiconductor functionality.

Career Highlights

Shaofeng Ding is currently making strides at Samsung Electronics Co., Ltd., a leading global player in the semiconductor and electronics sector. His experience and deep understanding of semiconductor technologies have allowed him to contribute to crucial projects, pushing the boundaries of electronic device performance. His work has not only influenced product development but has also set new industry standards.

Collaborations

Throughout his career, Ding has worked alongside esteemed colleagues, including Jeong Hoon Ahn and Yun Ki Choi. Their collaborative efforts have fostered a productive environment where innovative ideas can flourish, leading to advancements in semiconductor solutions that benefit various electronic applications.

Conclusion

Shaofeng Ding continues to be a pivotal figure in the field of semiconductor technology, with a growing portfolio of patents that underscore his innovative spirit. His contributions at Samsung Electronics Co., Ltd. and his partnerships with fellow inventors illustrate his commitment to advancing the future of electronics through groundbreaking inventions. As technology evolves, Ding’s work promises to leave a lasting impact on the landscape of semiconductor design and application.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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