The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Oct. 01, 2024
Filed:
Nov. 02, 2021
Applicant:
Samsung Electronics Co., Ltd., Suwon-si, KR;
Inventors:
Shaofeng Ding, Suwon-si, KR;
Sungwook Moon, Yongin-si, KR;
Jeonghoon Ahn, Seongnam-si, KR;
Yunki Choi, Yongin-si, KR;
Assignee:
SAMSUNG ELECTRONICS CO., LTD., Suwon-si, KR;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 21/00 (2006.01); H01L 23/48 (2006.01); H01L 23/522 (2006.01); H01L 25/065 (2023.01);
U.S. Cl.
CPC ...
H01L 23/481 (2013.01); H01L 23/5226 (2013.01); H01L 25/0657 (2013.01); H01L 2225/06541 (2013.01);
Abstract
A semiconductor chip may include; a device layer including transistors on a substrate, a wiring layer on the device layer, a first through via passing through the device layer and the substrate, and a second through via passing through the wiring layer, the device layer and the substrate, wherein a first height of the first through via is less than a second height of the second through via.