The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Aug. 25, 2026

Filed:

Oct. 27, 2022
Applicant:

Samsung Electronics Co., Ltd., Suwon-si, KR;

Inventors:

Jihyung Kim, Seoul, KR;

Jaehee Oh, Seongnam-si, KR;

Jegwan Hwang, Suwon-si, KR;

Shaofeng Ding, Suwon-si, KR;

Won Ji Park, Suwon-si, KR;

Jeong Hoon Ahn, Seongnam-si, KR;

Yun Ki Choi, Yongin-si, KR;

Assignee:
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H10W 20/40 (2026.01); H10D 30/01 (2025.01); H10D 30/62 (2025.01); H10D 84/01 (2026.01); H10D 84/03 (2025.01); H10D 84/83 (2025.01); H10W 20/41 (2026.01); H10W 20/42 (2026.01);
U.S. Cl.
CPC ...
H10W 20/496 (2026.01); H10D 30/024 (2025.01); H10D 30/6211 (2025.01); H10D 84/0149 (2025.01); H10D 84/0158 (2025.01); H10D 84/038 (2025.01); H10D 84/834 (2025.01); H10W 20/42 (2026.01); H10W 20/427 (2026.01); H10W 20/435 (2026.01);
Abstract

A semiconductor device includes a semiconductor substrate having a first surface and a second surface opposite to the first surface; a transistor provided on the first surface of the semiconductor substrate; a power rail provided on the first surface of the semiconductor substrate and electrically connected to the transistor; first and second lower interconnection lines provided on the second surface of the semiconductor substrate and spaced apart from each other in a first direction perpendicular to the second surface of the semiconductor substrate; a penetration via penetrating the semiconductor substrate and connecting a corresponding one of the first and second lower interconnection lines to the power rail; and a capacitor provided between and electrically connected to the first and second lower interconnection lines.


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