The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jun. 18, 2024

Filed:

May. 14, 2020
Applicant:

Samsung Electronics Co., Ltd., Suwon-si, KR;

Inventors:

Shaofeng Ding, Suwon-si, KR;

Jeong Hoon Ahn, Seongnam-si, KR;

Yun Ki Choi, Yongin-si, KR;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 21/311 (2006.01); H01L 21/48 (2006.01); H05K 3/10 (2006.01); H01L 23/64 (2006.01);
U.S. Cl.
CPC ...
H01L 21/486 (2013.01); H05K 3/107 (2013.01); H01L 23/642 (2013.01);
Abstract

The method of manufacturing an interposer includes providing a substrate including a first region and a second region adjacent to the first region, forming a first mold structure on the substrate, forming a photoresist layer on the first mold structure, forming a first transfer pattern over the photoresist layer on the first region, using a first photomask, forming a second transfer pattern over the photoresist layer on the second region, using the first photomask, forming a mask pattern on the first mold structure, using the first transfer pattern and the second transfer pattern and forming a first trench and a second trench in the first mold structure, using the mask pattern, the first trench being formed in the first region, and the second trench being formed in the second region.


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