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For the Inventor, By the Inventor

Suwon-si, South Korea

Seung Yeop Lee

USPTO Granted Patents = 13 

Average Co-Inventor Count = 1.6

ph-index = 2

Forward Citations = 16(Granted Patents)


Location History:

  • Seoul, KR (2014 - 2015)
  • Suwon-si, KR (2016 - 2021)
  • Icheon-si Gyeonggi-do, KR (2021)
  • Gyeonggi-do, KR (2021)
  • Icheon-si, KR (2021 - 2023)

Company Filing History:

goldMedal13 out of 10,938 
 
Skhynix Inc.
 patents

Years Active: 2014-2023

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13 patents (USPTO):Explore Patents
1. 11742340 - Semiconductor package including stacked semiconductor chips (2023-08-29),
2. 11309303 - Semiconductor package including stacked semiconductor chips (2022-04-19),
3. 11195827 - Semiconductor integrated circuit device including an electro-static discharge protection circuit (2021-12-07),
4. 11164833 - Semiconductor device using wires and stacked semiconductor package (2021-11-02),
5. 11158626 - Semiconductor integrated circuit device including an electrostatic discharge protection circuit (2021-10-26),
6. 11152335 - Stack packages including a supporting substrate (2021-10-19),
7. 11004831 - Stack packages including a fan-out sub-package (2021-05-11),
8. 10262972 - Semiconductor packages including stacked chips (2019-04-16),
9. 9888567 - Flexible device including sliding interconnection structure (2018-02-06),
10. 9397024 - Semiconductor devices with optical through via structures, memory cards including the same, and electronic systems including the same (2016-07-19),
11. 9184137 - Semiconductor chip and semiconductor package having the same (2015-11-10),
12. 8816360 - Multi-chip package cross-reference to related applications (2014-08-26),
13. 8772937 - Semiconductor device including inner interconnection structure able to conduct signals or voltages in the semiconductor chip with vertical connection vias and horizontal buried conductive lines (2014-07-08),

Title: Innovations of Seung Yeop Lee in Semiconductor Technology

Introduction

Seung Yeop Lee is a prominent inventor based in Suwon-si, South Korea. He has made significant contributions to the field of semiconductor technology, holding a total of 13 patents. His work focuses on enhancing the efficiency and functionality of semiconductor packages.

Latest Patents

One of his latest patents is a semiconductor package that includes stacked semiconductor chips. This innovative package features a substrate and a sub semiconductor package positioned above it. The sub semiconductor package contains a sub semiconductor chip with chip pads on its active surface facing the substrate. It also includes a sub molding layer that surrounds the side surfaces of the sub semiconductor chip, along with redistribution conductive layers that connect to the chip pads. These layers extend under the surface of the sub molding layer, incorporating both signal and power redistribution conductive layers, each with their respective pads. This design allows for improved electrical connections and overall performance of semiconductor devices.

Career Highlights

Seung Yeop Lee is currently employed at SK Hynix Inc., a leading company in the semiconductor industry. His work has been instrumental in advancing semiconductor packaging technologies, which are crucial for modern electronic devices. His innovative designs have contributed to the efficiency and miniaturization of semiconductor components.

Collaborations

Throughout his career, Seung Yeop Lee has collaborated with notable colleagues, including Ju Il Eom and Han Jun Bae. These partnerships have fostered a collaborative environment that encourages innovation and the development of cutting-edge technologies.

Conclusion

Seung Yeop Lee's contributions to semiconductor technology through his patents and collaborations highlight his role as a key innovator in the field. His work continues to influence the advancement of semiconductor packaging, making significant strides in the industry.

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