The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Aug. 26, 2014
Filed:
Jul. 23, 2012
Applicant:
Seung Yeop Lee, Seoul, KR;
Inventor:
Seung Yeop Lee, Seoul, KR;
Assignee:
SK Hynix Inc., Gyeonggi-do, KR;
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 27/15 (2006.01); H01L 29/16 (2006.01); H01L 31/12 (2006.01); H01L 33/00 (2010.01);
U.S. Cl.
CPC ...
Abstract
A multi-chip package includes a lower substrate; at least two semiconductor chips stacked over the lower substrate and each defined with a via hole; an upper substrate coupled to a semiconductor chip positioned uppermost among the semiconductor chips; a light emitting part coupled to the lower substrate corresponding to the via hole; an electrowetting liquid lens coupled to a lower surface of the upper substrate for receiving a signal transferred from the light emitting part through the via hole; a light receiving part coupled to a sidewall of the via hole of each semiconductor chip configured to receive a signal from the electrowetting liquid lens.