The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Nov. 02, 2021
Filed:
Mar. 31, 2020
SK Hynix Inc., Icheon-si, KR;
Young Jo Park, Yongin-si, KR;
Seung Yeop Lee, Icheon-si, KR;
SK hynix Inc., Icheon-si, KR;
Abstract
Disclosed are a semiconductor device and a stacked semiconductor package. The semiconductor device may include a semiconductor chip and a plurality of chip pads disposed on the semiconductor chip in a second horizontal direction perpendicular to a first horizontal direction. The plurality of chip pads may include: a first chip pad connected to a wire extending in the first horizontal direction, when seen from the top; and a second chip pad connected to a diagonal wire extending in a direction at an angle to the first and second horizontal directions, when seen from the top. The width of the first chip pad in the second horizontal direction may be smaller than the width of the second chip pad in the second horizontal direction.