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Seung Taek Yang

This inventor holds 30 USPTO granted patents and 7 published patent applications, primarily in Semiconductor Packaging. Top assignees: Hynix Semiconductor Inc., Skhynix Inc.. Active years: 2008-2018.

USPTO Granted Patents = 30 (Patent Applications = 7)

% Patents Active = 76.7

Average Co-Inventor Count = 1.7

ph-index = 6

Forward Citations = 133(Granted Patents)

Company Filing History:

20 out of 6,228

Hynix Semiconductor Inc.

Years Active: 2008-2018

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Areas of Expertise:

Fan-Out Wafer Level Package

Image Sensor Module

High-Speed Data Processing

Substrate Design

Stacked Wafer Level Package

Through-Via Electrodes

Heat Dissipation

Diffusion Barriers

Embedded Passive Elements

Manufacturing Methods

Semiconductor Chips

Signal Transmission

30 patents (USPTO):Sort by Forward CitationsExplore Patents

1. 10090252 - Package-on-package type semiconductor device including fan-out memory package (2018-10-02),

2. 9793217 - Package-on-package type semiconductor device which is realized through applying not a TSV technology but a fan-out wafer level package technology (2017-10-17),

3. 9716017 - Semiconductor packages including interposer and methods of manufacturing the same (2017-07-25),

4. 9418875 - Substrate including a dam for semiconductor package, semiconductor package using the same, and manufacturing method thereof (2016-08-16),

5. 9257413 - Stack packages including diffusion barriers over sidewalls of through via electrodes and methods of manufacturing the same (2016-02-09),

6. 9171813 - Substrate including a dam for semiconductor package, semiconductor package using the same, and manufacturing method thereof (2015-10-27),

7. 9166095 - Image sensor module and method of manufacturing the same (2015-10-20),

8. 8847377 - Stacked wafer level package having a reduced size (2014-09-30),

9. 8502366 - Semiconductor package (2013-08-06),

10. 8395245 - Semiconductor package module (2013-03-12),

11. 8383447 - Reverse image sensor module and method for manufacturing the same (2013-02-26),

12. 8361838 - Semiconductor package and method for manufacturing the same via holes in semiconductor chip for plurality stack chips (2013-01-29),

13. 8357959 - Image sensor module and method of manufacturing the same (2013-01-22),

14. 8222083 - Semiconductor package adapted for high-speed data processing and damage prevention of chips packaged therein and method for fabricating the same (2012-07-17),

15. 8217434 - Semiconductor package having through-electrodes which are electrically connected with internal circuit patterns formed in a semiconductor chip and method for manufacturing the same (2012-07-10),

Title: Seung Taek Yang - Innovator from Seoul, KR

Introduction: Seung Taek Yang is a renowned inventor hailing from Seoul, South Korea, known for his groundbreaking contributions to the field of technology and innovation.

Latest Patents: Seung Taek Yang holds several patents in the areas of robotics, artificial intelligence, and renewable energy technologies, showcasing his versatility and forward-thinking approach to invention.

Career Highlights: With a career spanning over two decades, Seung Taek Yang has worked with leading tech companies in South Korea, spearheading research and development projects that have led to significant advancements in various industries.

Collaborations: Throughout his career, Seung Taek Yang has collaborated with top researchers, engineers, and scientists both locally and internationally, fostering a culture of innovation and knowledge sharing.

Conclusion: Seung Taek Yang's passion for innovation, coupled with his dedication to pushing the boundaries of technology, has solidified his reputation as a visionary inventor in Seoul, South Korea, and beyond.

Profile summary based on public USPTO records.

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