The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Sep. 30, 2014
Filed:
Aug. 08, 2012
Jong Hoon Kim, Gyeonggi-do, KR;
Min Suk Suh, Seoul, KR;
Seung Taek Yang, Seoul, KR;
Seung Hyun Lee, Gyeonggi-do, KR;
Tae Min Kang, Seoul, KR;
Jong Hoon Kim, Gyeonggi-do, KR;
Min Suk Suh, Seoul, KR;
Seung Taek Yang, Seoul, KR;
Seung Hyun Lee, Gyeonggi-do, KR;
Tae Min Kang, Seoul, KR;
SK Hynix Inc., Gyeonggi-do, KR;
Abstract
A stacked wafer level package includes a first semiconductor chip having a first bonding pad and a second semiconductor chip having a second bonding pad. Both bonding pads of the semiconductor chips face the same direction. The second semiconductor chip is disposed in parallel to the first semiconductor chip. A third semiconductor chip is disposed over the first and second semiconductor chips acting as a supporting substrate. The third semiconductor chip has a third bonding pad that is exposed between the first and the second semiconductor chips upon attachment. Finally, a redistribution structure is electrically connected to the first, second, and third bonding pads.