Tae Min Kang

USPTO Granted Patents = 16 (Patent Applications = 4)

Average Co-Inventor Count = 1.5

ph-index = 4

Forward Citations = 37(Granted Patents)

Company Filing History:

9 out of 6,228

Hynix Semiconductor Inc.

Years Active: 2008-2017

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16 patents (USPTO):Sort by Forward CitationsExplore Patents

1. 9659833 - Semiconductor packages, methods of manufacturing the same, electronic systems including the same, and memory cards including the same (2017-05-23),

2. 9543251 - Semiconductor chip and semiconductor package having the same (2017-01-10),

3. 8847377 - Stacked wafer level package having a reduced size (2014-09-30),

4. 8836118 - Electronic device packages including bump buffer spring pads and methods of manufacturing the same (2014-09-16),

5. 8810309 - Stack package and method for selecting chip in stack package (2014-08-19),

6. 8729686 - Semiconductor package and a method for selecting a chip in the semiconductor package (2014-05-20),

7. 8680688 - Stack package having flexible conductors (2014-03-25),

8. 8383463 - Semiconductor package having an antenna with reduced area and method for fabricating the same (2013-02-26),

9. 8288873 - Stack package having flexible conductors (2012-10-16),

10. 8164200 - Stack semiconductor package and method for manufacturing the same (2012-04-24),

11. 8008754 - Semiconductor package having an antenna with reduced area and method for fabricating the same (2011-08-30),

12. 7994627 - Pad redistribution chip for compactness, method of manufacturing the same, and stacked package using the same (2011-08-09),

13. 7786600 - Circuit substrate having circuit wire formed of conductive polarization particles, method of manufacturing the circuit substrate and semiconductor package having the circuit wire (2010-08-31),

14. 7642632 - Pad redistribution chip for compactness, method of manufacturing the same, and stacked package using the same (2010-01-05),

15. 7550835 - Chip stack package utilizing a dummy pattern die between stacked chips for reducing package size (2009-06-23),

Title: Tae Min Kang: Innovator in Semiconductor Technology

Introduction

Tae Min Kang is a prominent inventor based in Seoul, South Korea. He has made significant contributions to the field of semiconductor technology, holding a total of 16 patents. His work focuses on innovative semiconductor packages and electronic systems, which have applications in various electronic devices.

Latest Patents

Kang's latest patents include advancements in semiconductor packages and methods of manufacturing them. One notable patent describes a semiconductor package that features an adhesive member with a trapezoidal cross-section. This design allows for a semiconductor chip to be securely attached to the package substrate. The semiconductor chip has a first surface and a second surface, with the second surface making contact with the adhesive member. Additionally, the chip includes a tension supplement pattern that enhances its structural integrity. Another patent details a semiconductor chip that incorporates a girder beam within its substrate, further improving its performance and reliability.

Career Highlights

Throughout his career, Tae Min Kang has worked with leading companies in the semiconductor industry, including Hynix Semiconductor Inc. and SK Hynix Inc. His experience in these organizations has allowed him to develop cutting-edge technologies that push the boundaries of semiconductor design and manufacturing.

Collaborations

Kang has collaborated with notable colleagues in the field, including Dae Woong Lee and Byoung Do Lee. These partnerships have fostered innovation and contributed to the advancement of semiconductor technologies.

Conclusion

Tae Min Kang's contributions to semiconductor technology are noteworthy, with a strong portfolio of patents that reflect his innovative spirit. His work continues to influence the industry and pave the way for future advancements in electronic systems.

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4 patents pending:

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