The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jun. 23, 2009
Filed:
Jul. 12, 2006
Tae Min Kang, Seoul, KR;
Tae Min Kang, Seoul, KR;
Hynix Semiconductor Inc., Kyoungki-do, KR;
Abstract
The chip stack package includes at least a printed circuit board having a bond finger and a ball land, and at least two semiconductor chips stacked on the printed circuit board while being spaced from each other and formed with a plurality of bonding pads. A dummy pattern die is attached to the upper surface of each semiconductor chip. The dummy pattern die is formed with a circuit pattern on its lower surface for electrical connection to the semiconductor chip. The dummy pattern is also formed with a via pattern on its upper side which is connected to the circuit pattern. The first solder balls electrically connects the bond finger with the circuit pattern while electrically connecting the via pattern of stacked dummy pattern dies with the circuit pattern. The second solder balls are attached to the ball land of the printed circuit board.