The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Oct. 16, 2012
Filed:
Jul. 16, 2010
Tae Min Kang, Seoul, KR;
You Kyung Hwang, Seoul, KR;
Jae-hyun Son, Gyeonggi-do, KR;
Dae Woong Lee, Gyeonggi-do, KR;
Byoung DO Lee, Gyeonggi-do, KR;
Yu Hwan Kim, Gyeonggi-do, KR;
Tae Min Kang, Seoul, KR;
You Kyung Hwang, Seoul, KR;
Jae-hyun Son, Gyeonggi-do, KR;
Dae Woong Lee, Gyeonggi-do, KR;
Byoung Do Lee, Gyeonggi-do, KR;
Yu Hwan Kim, Gyeonggi-do, KR;
Hynix Semiconductor Inc., Gyeonggi-do, KR;
Abstract
A stack package includes a first package having a first semiconductor chip and a first encapsulation member which seals the first semiconductor chip. A second package is stacked on the first package, and includes a second semiconductor chip and a second encapsulation member which seals the second semiconductor chip. Flexible conductors are disposed within the first encapsulation member of the first package in such a way as to electrically connect the first package and the second package.