The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Apr. 24, 2012
Filed:
Jul. 13, 2010
Tae Min Kang, Seoul, KR;
You Kyung Hwang, Seoul, KR;
Jae-hyun Son, Gyeonggi-do, KR;
Dae Woong Lee, Gyeonggi-do, KR;
Chul Keun Yoon, Gyeonggi-do, KR;
Byoung DO Lee, Gyeonggi-do, KR;
Yu Hwan Kim, Gyeonggi-do, KR;
Tae Min Kang, Seoul, KR;
You Kyung Hwang, Seoul, KR;
Jae-hyun Son, Gyeonggi-do, KR;
Dae Woong Lee, Gyeonggi-do, KR;
Chul Keun Yoon, Gyeonggi-do, KR;
Byoung Do Lee, Gyeonggi-do, KR;
Yu Hwan Kim, Gyeonggi-do, KR;
Hynix Semiconductor Inc., Gyeonggi-do, KR;
Abstract
A stack semiconductor package includes a first insulation member having engagement projections and a second insulation member formed having engagement grooves into which the engagement projections are to be engaged. First conductive members are disposed in the first insulation member and have portions which are exposed on the engagement projections. Second conductive members are disposed in the second insulation member in such a way as to face the first conductive members and have portions which are exposed in the engagement grooves. A first semiconductor chip is disposed within the first insulation member and is electrically connected to the first conductive members. A second semiconductor chip is disposed in the second insulation member and is electrically connected to the second conductive members.