The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Aug. 06, 2013

Filed:

Dec. 28, 2011
Applicant:

Seung Taek Yang, Seoul, KR;

Inventor:

Seung Taek Yang, Seoul, KR;

Assignee:

SK Hynix Inc., Gyeonggi-do, KR;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/48 (2006.01);
U.S. Cl.
CPC ...
Abstract

A semiconductor package includes a body having a first surface and a second surface facing away from the first surface, and formed with a groove in the first surface. First connection parts may electrically connect a portion of the first surface to a portion of the second surface of the body. Second connection parts may electrically connect a portion of a bottom portion of the groove to a portion of the second surface of the body. A lower device may be disposed in the groove of the body, and have third connection parts that are electrically connected with the second connection parts. An upper device may be disposed on the body and the lower device, and have fourth connection parts that are electrically connected with the first connection parts and the third connection parts.


Find Patent Forward Citations

Loading…