The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Mar. 12, 2013
Filed:
Dec. 11, 2007
Jong Hoon Kim, Gyeonggi-do, KR;
Min Suk Suh, Seoul, KR;
Seong Cheol Kim, Gyeongsangnam-do, KR;
Seung Taek Yang, Seoul, KR;
Seung Hyun Lee, Gyeonggi-do, KR;
Jong Hoon Kim, Gyeonggi-do, KR;
Min Suk Suh, Seoul, KR;
Seong Cheol Kim, Gyeongsangnam-do, KR;
Seung Taek Yang, Seoul, KR;
Seung Hyun Lee, Gyeonggi-do, KR;
Hynix Semiconductor Inc., Kyoungki-do, KR;
Abstract
A semiconductor package module includes a circuit board including a board body having a receiving portion and conductive patterns formed on the board body; a semiconductor package received in the receiving portion and having conductive terminals electrically connected to the conductive patterns and an s semiconductor chip electrically connected to the conductive terminals; and a connection member electrically connecting the conductive patterns and the conductive terminals. In the present invention, after a receiving portion having a receiving space is formed in the board body of a circuit board and a semiconductor package is received in the receiving portion, and a connection terminal of the semiconductor package and a conductive pattern of the board body are electrically connected using a connection member, a plurality of semiconductor packages can be stacked in a single circuit board without increasing the thickness thereby significantly improving data storage capacity and data processing speed of the semiconductor package module.