Hwaseong-si, South Korea

Seok-hyun Lee

USPTO Granted Patents = 13 

Average Co-Inventor Count = 2.4

ph-index = 3

Forward Citations = 15(Granted Patents)


Company Filing History:


Years Active: 2015-2024

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13 patents (USPTO):Explore Patents

Title: Innovations by Seok-hyun Lee: A Pioneer in Semiconductor Technology

Introduction

Seok-hyun Lee is an accomplished inventor based in Hwaseong-si, South Korea, recognized for his impactful contributions to the semiconductor industry. With a remarkable 13 patents to his name, Lee has been at the forefront of technological advancements in semiconductor packaging.

Latest Patents

Among his latest innovations, one notable patent is for a "Semiconductor package including interposer." This patent describes a sophisticated semiconductor package that incorporates a base substrate and a lower redistribution line structure featuring multiple patterns. Additionally, it involves at least one interposer with numerous first connection pillars, facilitating enhanced connectivity for semiconductor chips. Another significant patent titled "Semiconductor device and semiconductor package" focuses on improving the drop test characteristics and impact resistance of semiconductor devices. The innovative design includes a substrate with a conductive layer and insulating layer, optimizing the performance of the semiconductor package.

Career Highlights

Seok-hyun Lee works at Samsung Electronics Co., Ltd., where he leverages his expertise in pioneering semiconductor technologies. His extensive research and development efforts have significantly advanced the efficiency and reliability of semiconductor packages, thus contributing to the overall innovation landscape in the industry.

Collaborations

Throughout his career, Lee has collaborated with talented colleagues like Jong-youn Kim and Youn-ji Min. These partnerships have fostered a creative environment at Samsung Electronics, enabling the team to push the boundaries of semiconductor technology further.

Conclusion

Seok-hyun Lee's contributions to semiconductor technology underline his innovative spirit and dedication to excellence. His patents reflect a commitment to enhancing the performance and durability of semiconductor devices, positioning him as a key figure in the field. As technological demands continue to evolve, the impact of Lee's work is sure to resonate throughout the industry for years to come.

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