The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jul. 28, 2015
Filed:
Jul. 17, 2013
Samsung Electronics Co., Ltd., Suwon-Si, Gyeonggi-Do, KR;
Seok-Hyun Lee, Hwaseong-si, KR;
Jin-Woo Park, Seoul, KR;
SAMSUNG ELECTRONICS CO., LTD., Gyeonggi-Do, KR;
Abstract
According to example embodiments, a semiconductor package includes: a lower molding element; a lower semiconductor chip in the lower molding element and having lower chip pads on an upper surface and at an areas close to first and second sides of the lower molding element; conductive pillars surrounding the lower semiconductor chip and passing through the lower molding element; an upper semiconductor chip on the upper surface of the lower molding element and lower semiconductor chip, the upper semiconductor chip having upper chip pads on a top surface and at areas close to third and the fourth sides of the upper semiconductor chip, and a connecting structure on the lower molding element and the upper semiconductor chip and electrically connecting each of the lower chip pads and upper chip pads to a corresponding conductive pillar. The upper semiconductor chip is substantially orthogonal to the lower semiconductor chip.