The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Apr. 14, 2020
Filed:
Jan. 12, 2018
Samsung Electronics Co., Ltd., Suwon-si, KR;
Jong-youn Kim, Seoul, KR;
Seok-hyun Lee, Hwaseong-si, KR;
Youn-ji Min, Seoul, KR;
Kyoung-lim Suk, Suwon-si, KR;
Seok-won Lee, Seoul, KR;
SAMSUNG ELECTRONICS CO., LTD., Suwon-si, KR;
Abstract
A semiconductor package may include a semiconductor chip; a molding portion configured to surround at least a side surface of the semiconductor chip; a passivation layer including a contact plug connected to the semiconductor chip and having a narrowing width further away from the semiconductor chip in a vertical direction, below the semiconductor chip; and a redistribution layer portion electrically connecting the semiconductor chip with an external connection terminal, below the passivation layer. The redistribution layer portion may include: an upper pad connected to the contact plug and a fine pattern positioned at a same level as the upper pad in an upper part of the redistribution layer portion; a redistribution layer and a via plug, which has a widening width further away from the semiconductor chip in the vertical direction, in a body part of the redistribution layer portion; and a lower pad connected to the external connection terminal and exposed to an outside of the semiconductor package in a lower part of the redistribution layer portion.