The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Aug. 30, 2016

Filed:

Jan. 13, 2015
Applicants:

Baik-woo Lee, Gwangmyeong-si, KR;

Seok-hyun Lee, Hwaseong-si, KR;

Inventors:

Baik-Woo Lee, Gwangmyeong-si, KR;

Seok-Hyun Lee, Hwaseong-si, KR;

Assignee:

SAMSUNG ELECTRONICS CO., LTD., Suwon-si, Gyeonggi-do, KR;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 25/18 (2006.01); H01L 25/065 (2006.01); H01L 23/498 (2006.01); H01L 23/538 (2006.01); H01L 23/13 (2006.01); H01L 25/10 (2006.01); H01L 23/00 (2006.01); H01L 23/31 (2006.01); H01L 25/16 (2006.01);
U.S. Cl.
CPC ...
H01L 25/0657 (2013.01); H01L 23/13 (2013.01); H01L 23/3135 (2013.01); H01L 23/49838 (2013.01); H01L 23/5389 (2013.01); H01L 25/105 (2013.01); H01L 23/3128 (2013.01); H01L 24/17 (2013.01); H01L 25/16 (2013.01); H01L 2224/0401 (2013.01); H01L 2224/0557 (2013.01); H01L 2224/06181 (2013.01); H01L 2224/16145 (2013.01); H01L 2224/16227 (2013.01); H01L 2224/17181 (2013.01); H01L 2224/32225 (2013.01); H01L 2224/48091 (2013.01); H01L 2224/48227 (2013.01); H01L 2224/73204 (2013.01); H01L 2224/73265 (2013.01); H01L 2225/06513 (2013.01); H01L 2225/06517 (2013.01); H01L 2225/06541 (2013.01); H01L 2225/06565 (2013.01); H01L 2225/1023 (2013.01); H01L 2225/1058 (2013.01); H01L 2225/1088 (2013.01); H01L 2225/1094 (2013.01); H01L 2924/141 (2013.01); H01L 2924/1426 (2013.01); H01L 2924/15159 (2013.01); H01L 2924/15311 (2013.01); H01L 2924/15331 (2013.01); H01L 2924/19103 (2013.01); H01L 2924/19105 (2013.01);
Abstract

A semiconductor device includes a substrate having a first part and a second part, the first and second parts being continuous with each other and at different height levels, a first semiconductor chip overlapping the first and second parts of the substrate, an electrical interconnection structure connecting the first part of the substrate and the first semiconductor chip, a distance between the first part of the substrate and the first semiconductor chip being shorter than a distance between the second part of the substrate and the first semiconductor chip, and at least one electronic component in a space between the second part of the substrate and the first semiconductor chip.


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