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Tainan, Taiwan

Sen-Huan Huang

This inventor holds 8 USPTO granted patents. Top assignees: Vanguard International Semiconductor Corporation, Winbond Electronics Corporation, Windbond Electronics Corp.. Active years: 1999-2002.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Sen-Huan Huang. Retrieved from https://idiyas.com/inventor/sen-huan-huang

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

USPTO Granted Patents = 8

% Patents Active = 100.0

Average Co-Inventor Count = 3.1

ph-index = 4

Forward Citations = 86(Granted Patents)


Company Filing History:

goldMedal5 out of 1,132 
 
Vanguard International Semiconductor Corporation
 patents
silverMedal2 out of 2,114 
 
Winbond Electronics Corporation
 patents
bronzeMedal1 out of 106 
 
Windbond Electronics Corp.
 patents

Years Active: 1999-2002

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8 patents (USPTO):Explore Patents
1. 6352896 - Method of manufacturing DRAM capacitor (2002-03-05),
2. 6291355 - Method of fabricating a self-aligned contact opening (2001-09-18),
3. 6187627 - Lading plug contact pattern for DRAM application (2001-02-13),
4. 6114198 - Method for forming a high surface area capacitor electrode for DRAM (2000-09-05),
5. 6080664 - Method for fabricating a high aspect ratio stacked contact hole (2000-06-27),
6. 6077742 - Method for making dynamic random access memory (DRAM) cells having (2000-06-20),
7. 5952156 - Enhanced reflectivity coating (ERC) for narrow aperture width contact (1999-09-14),
8. 5943599 - Method of fabricating a passivation layer for integrated circuits (1999-08-24),
Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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