Hachioji, Japan

Seiki Harada


Average Co-Inventor Count = 3.8

ph-index = 9

Forward Citations = 245(Granted Patents)


Location History:

  • Hachioji, JA (1977)
  • Hachioji, JP (1978 - 2004)

Company Filing History:


Years Active: 1977-2004

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12 patents (USPTO):Explore Patents

Title: **The Innovations of Seiki Harada**

Introduction

Seiki Harada, an accomplished inventor based in Hachioji, Japan, has made significant contributions to the field of semiconductor technology. With a total of 12 patents to his name, his work is instrumental in addressing critical challenges within the industry, particularly concerning soft errors and the penetration of impurities in semiconductor devices.

Latest Patents

Among his most recent innovations, Harada has developed an integrated circuit that features a coating film made of a polyimide resin or a polyimide isoindoloquinazolinedione resin. This film, which is at least 10 micrometers thick, is strategically placed on the active region of a semiconductor substrate. Subsequently, the substrate is encapsulated in a ceramic package. These advancements have led to a notable reduction in troubles associated with alpha-rays emitted by impurities in the package material.

Career Highlights

Seiki Harada's career includes working with renowned companies such as Hitachi, Ltd., where he engaged in groundbreaking research and development activities. His expertise and innovative mindset have significantly advanced the semiconductor industry, promoting more reliable and efficient devices.

Collaborations

Throughout his career, Harada has collaborated with talented individuals such as Atsushi Saiki and Kiichiro Mukai. These partnerships have fostered a collaborative spirit, enabling the exchange of ideas and pushing the boundaries of semiconductor technology further.

Conclusion

Seiki Harada's inventive spirit, demonstrated through his impactful patents and collaboration with industry peers, highlights his vital role in technological advancements within the semiconductor sector. His work continues to inspire future innovations that enhance device performance and reliability.

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