The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jun. 08, 2004
Filed:
Dec. 22, 1994
Applicant:
Inventors:
Assignee:
Hitachi, Ltd., , JP;
Primary Examiner:
Int. Cl.
CPC ...
H01L 2/358 ; H01L 2/306 ; H01L 2/304 ; H01L 2/940 ;
U.S. Cl.
CPC ...
H01L 2/358 ; H01L 2/306 ; H01L 2/304 ; H01L 2/940 ;
Abstract
A semiconductor device wherein a coating film which is made of a polyimide resin or a polyimide isoindoloquinazolinedione resin and which is at least 10 &mgr;m thick is disposed on at least an active region of a semiconductor substrate, and the resultant semiconductor substrate is encapsulated in a ceramic package. The semiconductor device has troubles relieved conspicuously, the troubles being ascribable to alpha-rays which come flying from impurities contained in the material of the package.
Mukai, Kiichiro. (2004). Integrated circuit having reduced soft errors and reduced penetration of alkali impurities into the substrate (U.S. Patent No. 6747339). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/6747339
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile