Company Filing History:

7 out of 164,108

International Business Machines Corporation

Northern Telecom Limited

where one patent can have more than one assignee

Years Active: 1988-1994

where 'Filed Patents' based on already Granted Patents

9 patents (USPTO):Sort by Forward Citations

Abstract keywords

1. 5325265 - High performance integrated circuit chip package (1994-06-28),

2. 5192716 - Method of making a extended integration semiconductor structure (1993-03-09),

3. 5055907 - Extended integration semiconductor structure with wiring layers (1991-10-08),

4. 4981909 - Plasma-resistant polymeric material, preparation thereof, and use thereof (1991-01-01),

5. 4866507 - Module for packaging semiconductor integrated circuit chips on a base (1989-09-12),

6. 4828964 - Polyimide formulation for forming a patterned film on a substrate (1989-05-09),

7. 4817093 - Method of partitioning, testing and diagnosing a VLSI multichip package (1989-03-28),

8. 4811082 - High performance integrated circuit packaging structure (1989-03-07),

9. 4782008 - Plasma-resistant polymeric material, preparation thereof, and use thereof (1988-11-01),

Title: Scott L Jacobs: Innovator in Integrated Circuit Technology

Introduction

Scott L Jacobs is a prominent inventor based in Apex, NC (US), known for his significant contributions to the field of integrated circuit technology. With a total of 9 patents to his name, Jacobs has made remarkable advancements that enhance the performance and efficiency of semiconductor devices.

Latest Patents

Among his latest innovations is a high-performance integrated circuit chip package. This invention features a support substrate with conductors extending from one face to the opposite face, along with a multilayer wiring substrate for connecting chips. The design includes a heat sink with microchannels, which utilizes thermally conductive cushions to ensure effective heat dissipation. Another notable patent is the method of making an extended integration semiconductor structure. This invention provides a low-cost, lightweight, and reliable solution by forming a thin film multilayer wiring decal on a support substrate, allowing for efficient integration of multiple chips.

Career Highlights

Throughout his career, Scott L Jacobs has worked with esteemed companies such as IBM and Mosaic, Ltd. His experience in these organizations has contributed to his expertise in semiconductor technology and innovation.

Collaborations

Jacobs has collaborated with talented individuals in the field, including Perwaiz Nihal and Burhan Ozmat. These partnerships have fostered a creative environment that has led to groundbreaking advancements in integrated circuit design.

Conclusion

Scott L Jacobs stands out as a key figure in the realm of integrated circuit technology, with a proven track record of innovation and collaboration. His contributions continue to shape the future of semiconductor devices and enhance their performance.

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